MMPack: Multi-Mask Co-Design for Ultra-Large Wafer-Scale Package Integration
S.Y. Li, Z. Zhuang, S.Y. Liang, B. Yu, T.-Y. Ho, "MMPack: Multi-Mask Co-Design for Ultra-Large Wafer-Scale Package Integration," The 44th ACM/IEEE International Conference on Computer-Aided Design (ICCAD), 2025.