Download (as of Oct, 2026)

Education

Honorary Graduate, Qian Xuesen Honors College, Xi’an Jiaotong University, 2022
B.E. in Electrical Engineering & Automation (Elite Class), Xi’an Jiaotong University, 2022
Ph.D. in Computer Engineering, The Chinese University of Hong Kong, 2026 (expected)

Experiences

Technical University of Munich, Visiting Doctoral Candidate, Aug 2024-Feb 2025
- Supervisor: Prof. Dr.-Ing. Ulf Schlichtmann, Project: Design automation tools for microfluidic biochips
Santa Clara University, Visiting Scholar, Jun 2024-Jul 2024
- Supervisor: Prof. Ismail Emre Araci, Project: Demo fabrication of microfluidic biochips
Xi’an Action Electronics Co., Ltd, Assistant Software Engineer, Jul 2021-Aug 2021
- Duties included: Developing power control simulation software for PV arrays
Loten Semiconductor Co., Ltd, Assistant Hardware Engineer, Jun 2019-Aug 2019
- Duties included: Testing and calibrating samples, managing laboratory samples, arranging cargo delivery

Publications

CUTh-Extractor: ViT-Based Efficient Extraction of Orthotropic Thermo-Mechanical Material Properties in Advanced Packaging

C.H. Wang, Z. Zhuang, S.Y. Liang, T. Tian, C.Y. Liang, D.R. Huang, R.M. Chen, T.-Y. Ho, "CUTh-Extractor: ViT-Based Efficient Extraction of Orthotropic Thermo-Mechanical Material Properties in Advanced Packaging," Electronics Packaging Technology Conference (EPTC), 2026.

DiffCool: Label-Free Synthesis of Chip-Tailored Heat Sinks via Thermal-Aware Diffusion

S.Y. Liang, Z.X. Wang, C.H. Wang, S.Y. Li, Y.S. Zhang, L.L. Jin, Z. Zhuang, U. Schlichtmann, B. Yu, T.-Y. Ho, "DiffCool: Label-Free Synthesis of Chip-Tailored Heat Sinks via Thermal-Aware Diffusion," The 40th Annual Conference on Neural Information Processing Systems (NeurIPS), 2026.

Vertical PDN Routing and Embedded IVR Placement Co-Optimization for Advanced Packaging

Z. Zhuang, S.Y. Liang, Y. Du, L. Du, B. Yu, "Vertical PDN Routing and Embedded IVR Placement Co-Optimization for Advanced Packaging," The 45th ACM/IEEE International Conference on Computer-Aided Design (ICCAD), 2026.

SGLayout: Schema-Guided Closed-Loop Refinement for LLM-Driven Parameterized Layout Generation

S.Y. Chen, Y. Pu, Y.H. Qin, S.T. Lin, S.Y. Liang, Z.L. He, L.N. Zhang, B. Yu, "SGLayout: Schema-Guided Closed-Loop Refinement for LLM-Driven Parameterized Layout Generation," The 45th ACM/IEEE International Conference on Computer-Aided Design (ICCAD), 2026.

Reliable Control-Layer Routing for Microfluidic Biochips via Bayesian Optimization

S.Y. Liang, R.L. Fu, M.C. Li, Z.Q. Jia, T.-M. Tseng, U. Schlichtmann, T.-Y. Ho, "Reliable Control-Layer Routing for Microfluidic Biochips via Bayesian Optimization," IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), 2026.

A Two-Layer Decoupled Synthesis Framework for Uncertain Biochemical Protocols on Active-Matrix Digital Microfluidic Platforms

C. Jiang, S.Y. Liang, R.L. Fu, B.B. Zhang, M.L. Zhang, Q.N. Wang, X. Huang, B. Yuan, Z.Q. Jia, H.B. Ma, T.-Y. Ho, "A Two-Layer Decoupled Synthesis Framework for Uncertain Biochemical Protocols on Active-Matrix Digital Microfluidic Platforms," IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), 2026.

BLADE: Bi-Level Bayesian Optimization for Metal-Density-Constrained Multi-Layer Package Power/Ground Plane Synthesis

S.Y. Liang, S.Y. Li, L.L. Jin, Y. Pu, Y.S. Zhang, Z. Zhuang, K.-Y. Chao, U. Schlichtmann, T.-Y. Ho, "BLADE: Bi-Level Bayesian Optimization for Metal-Density-Constrained Multi-Layer Package Power/Ground Plane Synthesis," The 63rd ACM/IEEE Design Automation Conference (DAC), 2026.

LiPCon: A Physics-Aware Spatially Resolved Light Penetration Compensation Method for Low-Cost 3D-Printed Microfluidics

Y.S. Zhang, S.Y. Liang, T.-M. Tseng, U. Schlichtmann, "LiPCon: A Physics-Aware Spatially Resolved Light Penetration Compensation Method for Low-Cost 3D-Printed Microfluidics," The 63rd ACM/IEEE Design Automation Conference (DAC), 2026.

BSPDN-Elite: A Comprehensive Framework for Optimizing Timing, Power and Routing Resources in BSPDN Designs

L.L. Jin, H.Y. Xu, S.Y. Liang, Z. Zhuang, Z. Hu, Z.X. Wang, B. Yu, R.M. Chen, T.-Y. Ho, "BSPDN-Elite: A Comprehensive Framework for Optimizing Timing, Power and Routing Resources in BSPDN Designs," The 63rd ACM/IEEE Design Automation Conference (DAC), 2026.

FlexiCTS: CPPR-Aware 3D Clock Tree Synthesis for Face-to-Face Bonded ICs

S.Y. Li, L.L. Jin, S.Y. Liang, Z. Zhuang, R.M. Chen, B. Yu, T.-Y. Ho, "FlexiCTS: CPPR-Aware 3D Clock Tree Synthesis for Face-to-Face Bonded ICs," The 63rd ACM/IEEE Design Automation Conference (DAC), 2026.

Late Breaking Results: ‘Describing’ Your Way to a Functional Microfluidic Chip

Y.S. Zhang, L. Dickgießer, S.Y. Liang, T.-M. Tseng, S. Yamashita, T.-Y. Ho, U. Schlichtmann, "Late Breaking Results: 'Describing' Your Way to a Functional Microfluidic Chip," The 63rd ACM/IEEE Design Automation Conference (DAC), 2026.

MMPack: Multi-Mask Co-Design for Ultra-Large Wafer-Scale Package Integration

S.Y. Li, Z. Zhuang, S.Y. Liang, B. Yu, T.-Y. Ho, "MMPack: Multi-Mask Co-Design for Ultra-Large Wafer-Scale Package Integration," The 44th ACM/IEEE International Conference on Computer-Aided Design (ICCAD), 2025.

Deep-Reinforcement-Learning-based Adaptive State-Feedback Control for Inter-Area Oscillation Damping with Continuous Eigenvalue Configurations

S.Y. Liang, L. Huo, W.Y. Qin, X. Chen, and P.Y. Sun, "Deep-Reinforcement-Learning-based Adaptive State-Feedback Control for Inter-Area Oscillation Damping with Continuous Eigenvalue Configurations," CSEE Journal of Power and Energy Systems (CSEE JPES), 2025.

Multi-Layer Package Power/Ground Planes Synthesis with Balanced DC IR Drops: A Game-Theoretic Optimization Approach

S.Y. Liang, Z. Zhuang, K.-Y. Chao, B. Yu, and T.-Y. Ho, "Multi-Layer Package Power/Ground Planes Synthesis with Balanced DC IR Drops: A Game-Theoretic Optimization Approach," IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), 2025.

AutoRE: Bayesian-Optimization-based Automatic Reliability Enhancement Tool for Flow-based Microfluidic Biochips

S.Y. Liang, Y.S. Zhang, M.C. Li, T.-M. Tseng, U. Schlichtmann, T.-Y. Ho, "AutoRE: Bayesian-Optimization-based Automatic Reliability Enhancement Tool for Flow-based Microfluidic Biochips," The 62nd Design Automation Conference (DAC), 2025.

Combinatorial-Coding-Based High-Performance Microfluidic Control Multiplexer: Design, Synthesis, and Adaptation

S.Y. Liang, M.C. Li, T.-M. Tseng, U. Schlichtmann, T.-Y. Ho, "Combinatorial-Coding-Based High-Performance Microfluidic Control Multiplexer: Design, Synthesis, and Adaptation," IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), 2024.

RABER: Reliability-Aware Bayesian-Optimization-based Control Layer Escape Routing for Flow-based Microfluidics

S.Y. Liang, R.L. Fu, M.C. Li, T.-M. Tseng, U. Schlichtmann, T.-Y. Ho, "RABER: Reliability-Aware Bayesian-Optimization-based Control Layer Escape Routing for Flow-based Microfluidics," The 43rd ACM/IEEE International Conference on Computer-Aided Design (ICCAD), 2024.

Late Breaking Results: Efficient Built-in Self-Test for Microfluidic Large-Scale Integration (mLSI)

M.C. Li, H.C. Gu, Y.S. Zhang, S.Y. Liang, H. Gasvoda, R. Altay, I. Araci, T.-M. Tseng, T.-Y. Ho and U. Schlichtmann, "Late Breaking Results: Efficient Built-in Self-Test for Microfluidic Large-Scale Integration (mLSI)," The 61st Design Automation Conference (DAC), 2024.

LaMUX: Optimized Logic-Gate-Enabled High-Performance Microfluidic Multiplexer Design

S.Y. Liang, Y.S. Zhang, R. Altay, H. Gasvoda, M.C. Li, I.E. Araci, T.-M. Tseng, U. Schlichtmann, T.-Y. Ho, "LaMUX: Optimized Logic-Gate-Enabled High-Performance Microfluidic Multiplexer Design," The 61st Design Automation Conference (DAC), 2024.

Rotor Angle Stability Prediction using Temporal and Topological Embedding Deep Neural Network Based on Grid-Informed Adjacency Matrix

P.Y. Sun, L. Huo, X. Chen, S.Y. Liang, "Rotor Angle Stability Prediction using Temporal and Topological Embedding Deep Neural Network Based on Grid-Informed Adjacency Matrix," Journal of Modern Power Systems and Clean Energy (MPCE), 2023.

ARMM: Adaptive Reliability Quantification Model of Microfluidic Designs and Its Graph-Transformer-Based Implementation

S.Y. Liang, M. Lian, M.C. Li, T.-M. Tseng, U. Schlichtmann, T.-Y. Ho, "ARMM: Adaptive Reliability Quantification Model of Microfluidic Designs and Its Graph-Transformer-Based Implementation," The 42nd IEEE/ACM International Conference on Computer-Aided Design (ICCAD), 2023.

Optimal Inter-area Oscillation Damping Control: A Transfer Deep Reinforcement Learning Approach with Switching Control Strategy

S.Y. Liang, L. Huo, X. Chen, P.Y. Sun, "Optimal Inter-area Oscillation Damping Control: A Transfer Deep Reinforcement Learning Approach with Switching Control Strategy," arXiv preprint arXiv:2301.09321, 2023.

CoMUX: Combinatorial-Coding-Based High-Performance Microfluidic Control Multiplexer Design

S.Y. Liang, M.C. Li, T.-M. Tseng, U. Schlichtmann, T.-Y. Ho, "CoMUX: Combinatorial-Coding-Based High-Performance Microfluidic Control Multiplexer Design," The 41st IEEE/ACM International Conference on Computer-Aided Design (ICCAD), 2022.

Fast Transient Stability Prediction Using Grid-informed Temporal and Topological Embedding Deep Neural Network

P.Y. Sun, L. Huo, S.Y. Liang, X. Chen, "Fast Transient Stability Prediction Using Grid-informed Temporal and Topological Embedding Deep Neural Network," arXiv preprint arXiv:2201.09245, 2022.

Finite Element Analysis based Optimized Vehicle Mounted Antenna Deployment

S.Y. Liang, Y.S. Li, C. Gao, "Finite Element Analysis based Optimized Vehicle Mounted Antenna Deployment," IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting (APS/URSI), 2021.

Skills

Programming (Python, C, Lua)
MCU Development (FPGA, C51, Arduino, Node MCU)
PCB Design (Altium Designer)
Engineering Software (MATLAB, Simulink, ANSYS, LTspice, Feko, AutoCAD)
Office Software (LaTEX, Markdown, Word, Excel, Powerpoint, Visio)
Miscellaneous (Kart Racing, Traditional Chinese Archery, Rowing, Tennis, Basketball, Swimming, Guitar, Video Clip, Photography, …)

Service and leadership

TPC (ICCAD)
Reviewer (ICCAD, ISEDA, NeurIPS, AAAI, FPL, IEEE TCAD, IEEE Design&Test, Elsevier Integration, IEEE SMCA).
More than 300 hours of social volunteer service.
CTO of μLabsAI entrepreneurship team (CUHK Incubated, CUHK IdeaBoost Funded, HKSTP Ideation Funded, HK 10th Techathon$^+$ Finale), 2025-Now.
CEO of Rhea Tech in technology entrepreneurship competitions during 2020-2022.
Monitor of class Electrical 81 (Elite Class) during 2018-2022.

Siyuan Liang