BLADE: Bi-Level Bayesian Optimization for Metal-Density-Constrained Multi-Layer Package Power/Ground Plane Synthesis
Published in The 63rd ACM/IEEE Design Automation Conference (DAC), 2026
Recommended citation: S.Y. Liang, S.Y. Li, L.L. Jin, Y. Pu, Y.S. Zhang, Z. Zhuang, K.-Y. Chao, U. Schlichtmann, T.-Y. Ho, "BLADE: Bi-Level Bayesian Optimization for Metal-Density-Constrained Multi-Layer Package Power/Ground Plane Synthesis," The 63rd ACM/IEEE Design Automation Conference (DAC), 2026.
In advanced packages, large power/ground (P/G) planes are essential for power integrity but prone to warpage due to CTE mismatch. While uniform metal-density constraints combat warpage, mandatory degassing holes complicate adherence to these constraints and degrade IR-drop.
We propose BLADE, the first P/G plane synthesis methodology that enforces uniform metal-density constraints while optimizing power integrity. BLADE expands P/G planes from skeletons under metal density control to ensure connectivity, naturally leaving holes for degassing. Guided by a fast IR-drop evaluator, our bi-level Bayesian optimization framework efficiently navigates the complex design space.
Experiments on six SiP cases demonstrate that BLADE simultaneously satisfies the metal-density constraint and achieves superior IR-drop performance compared to existing methods, addressing the critical co-design challenge spanning power integrity, manufacturing yield, and long-term reliability in next-generation advanced packaging.
