2026-10-26, I was glad to participate in the CEDAR Next Generation EDA Workshop and give a talk titled “Beyond Geometry: Engineering-Aware Design Automation for Advanced Packages,” sharing my vision and work on bringing industrial requirements into the design stage and building automated packaging design workflows.
2026-10-18, Excited to share that the DiffCool paper has been accepted by NeurIPS 2026! Our group’s first work in thermal management generates customized heat sinks from chip thermal profiles without requiring a labeled dataset, while satisfying manufacturing constraints.
2026-5-27, Defended my Ph.D. with the thesis titled “Beyond Trial and Error: Reliable and Efficient Microfluidics via Systematic Design”. 
2026-3-10, Great news, the BLADE paper gets accepted by DAC this year!
2025-6-28,Truly honored to receive this award and get reported by our department! See the report. It was a pleasure sharing my research and engaging in such meaningful discussions.
2025-6-11, Good things come to those who wait. After several rounds of revision, our first work in the field of packaging gets accepted by TCAD!
2025-2-15, Really great news, the AutoRE paper gets accepted by DAC this year!
2024-8-15, Cheers, the CoMUX extension paper is accepted by TCAD!
2024-6-25, Good news, the RABER paper gets accepted by ICCAD this year!
2024-2-14, Great news during the Chinese New Year, the LaMUX paper gets accepted by DAC this year!
2023-8-9, Really good news, the ARMM paper is formally accepted by ICCAD this year!
2022-8-15, Thanks to the hard work of co-authors, the CoMUX paper is finally accepted by ICCAD this year!
2022-8-1, Start the new journey as a Ph.D student at CUHK.
2022-7-2, A photo with the department head at the degree awarding site. 