Invited Talk at CEDAR Next Generation EDA Workshop

I was glad to participate in the CEDAR Next Generation EDA Workshop on 2026-10-26 and give a talk titled Beyond Geometry: Engineering-Aware Design Automation for Advanced Packages, where I shared my vision and work in this area.

CEDAR, the Centre for Next Generation EDA Research in Hong Kong (cedar.cse.cuhk.edu.hk), is a research centre led by CUHK, which is ranked World No. 1 in EDA by CSRankings. It is dedicated to advancing electronic design automation through AI, large circuit models, and high-performance computing, with a HK$75 million five-year research initiative.

In my talk, I discuss how to bring industrial requirements into the design stage and how to build automated packaging design workflows for advanced packages. The goal is to move beyond purely geometric design and make design automation engineering-aware, so that practical manufacturing and performance constraints can be considered early in the workflow.

Many thanks to the organizers for the invitation and to the audience for the engaging discussions!