Vertical PDN Routing and Embedded IVR Placement Co-Optimization for Advanced Packaging
Published in The 45th ACM/IEEE International Conference on Computer-Aided Design (ICCAD), 2026
Recommended citation: Z. Zhuang, S.Y. Liang, Y. Du, L. Du, B. Yu, "Vertical PDN Routing and Embedded IVR Placement Co-Optimization for Advanced Packaging," The 45th ACM/IEEE International Conference on Computer-Aided Design (ICCAD), 2026.
In advanced packaging, embedded integrated voltage regulators (IVRs) and the vertical power delivery network (PDN) are closely coupled: where the IVRs are placed affects how the vertical PDN must be routed, and the routing in turn affects power delivery. Optimizing the two separately can therefore overlook better joint solutions.
This paper presents a co-optimization approach for vertical PDN routing and embedded IVR placement in advanced packaging, treating the two problems together rather than as independent stages.