DiffCool: Label-Free Synthesis of Chip-Tailored Heat Sinks via Thermal-Aware Diffusion

Thermal management is a key concern in chip and package design, but heat sinks are often chosen from standard form factors rather than designed for the thermal behavior of a specific chip. Tailoring a heat sink to an individual chip is difficult, in part because the designs needed for supervised learning are generally not available.

This paper presents DiffCool, a label-free synthesis approach that generates chip-tailored heat sinks using diffusion models guided by thermal information. Because it does not rely on labeled design pairs, the approach targets settings where ground-truth heat sink designs are not available, while aiming to align the generated geometry with the thermal behavior of the target chip.