MMPack: Multi-Mask Co-Design for Ultra-Large Wafer-Scale Package Integration
Published in The 44th ACM/IEEE International Conference on Computer-Aided Design (ICCAD), Paper, 2025
This paper presents MMPack, a framework for chiplet-package co-design in large interposer-based systems. It introduces performance-driven partitioning, stitching-aware floorplanning, and stress-aware optimization to improve performance and reliability while maintaining scalability.
Recommended citation: S.Y. Li, Z. Zhuang, S.Y. Liang, B. Yu, T.-Y. Ho, "MMPack: Multi-Mask Co-Design for Ultra-Large Wafer-Scale Package Integration," The 44th ACM/IEEE International Conference on Computer-Aided Design (ICCAD), 2025.